Electronic devices release heat and do not work well when they get hot. For instance, when watching a long video on a smart phone, you will notice that it will get hot and the battery will drain very fast.
Electronic components, especially chips, both release heat and do not like heat. In order to work properly, they need to dissipate heat. Current advancements in miniaturization make the problem even worse, as there are many heat sources closer together.
The best substrates for dissipating heat are ceramic. However, ceramic substrates are not flexible, thus limiting the possibilities for miniaturization. Flexible PCBs, which are highly used in commercial electronics (smartphones, laptops, etc.) do not dissipate heat well.
Our Flexiramics® composites seek combining the best of the two worlds: the flexibility of polymer with the good thermal management of ceramics.
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